Making electrical connections between a circuit board and an integrated circuit
US7241147B2 · kind B2 · utility
3Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2004 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Apr 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/2435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A socket may receive both ball grid and land grid array packages. Thus, in some embodiments, the early package prototypes, without solder balls, may be packaged in the same socket design that is ultimately used for production devices using ball grid array packaging. Both land grid array and ball grid arrays may be self-centered on the socket in some embodiments. An S-shaped spring contact may be utilized to electrically connect to either solder balls or lands in a wiping action.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.