Adhesive, method of connecting wiring terminals and wiring structure
US7241644B2 · kind B2 · utility
13Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2005 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Nov 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.