Electronic packaging using conductive interposer connector
US7241680B2 · kind B2 · utility
2Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2004 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | Jun 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10719
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.