System and method for reducing heat dissipation during burn-in
US7242205B1 · kind B1 · utility
5Cited by
18References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2005 |
| Grant date | Jul 10, 2007 |
| Priority date | — |
| Expiry date | May 23, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31721
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for reducing temperature dissipation during burn-in testing are described. A plurality of devices under test are each subject to a body bias voltage. The body bias voltage reduces leakage current associated with the devices under test. Accordingly, heat dissipation is reduced during burn-in. The body bias voltage is selected to achieve a desired junction temperature at the devices under test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.