Poly-o-hydroxyamide, polybenzoxazole from the poly-o-hydroxyamide, electronic component including a polybenzoxazole, and processes for producing the same

US7244803B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Recai Sezi · Simmerath, DE
• Andreas Walter · Egloffstein, DE
• Anna Maltenberger · Leutenbach, DE
• Klaus Lowack · Erlangen, DE
• Marcus Halik · Erlangen, DE

Key dates

• Filing date: Jun 27, 2003
• Grant date: Jul 17, 2007
• Expiry date: Nov 20, 2024

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31721
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k≦2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for micro-electronics.