Semiconductor module with improved interposer structure and method for forming the same
US7245022B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2003 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | Jul 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.