Semiconductor chip assembly with solder-attached ground plane
US7245023B1 · kind B1 · utility
25Cited by
33References
230Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 20, 2004 |
| Grant date | Jul 17, 2007 |
| Priority date | — |
| Expiry date | May 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, a solder joint and a ground plane. The pillar extends into an opening in the ground plane, the solder joint contacts and electrically connects the pillar and the ground plane, and the ground plane is electrically connected to the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.