Adhesive for bonding circuit members, circuit board, and method of producing the same
US7247381B1 · kind B1 · utility
10Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1998 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Aug 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing 100 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an adhesive resin composition and 10 to 200 parts by weight of an inorganic filler, a circuit board in which the circuit members are bonded together with the adhesive, and a method of producing the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.