Low voiding no flow fluxing underfill for electronic devices
US7247683B2 · kind B2 · utility
5Cited by
36References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2004 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Oct 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation method involving blending an epoxy component and a phenolic component, heating the blend, and cooling the blend, prior to incorporation of an anhydride component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.