Carrier, method of manufacturing a carrier and an electronic device
US7247938B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2003 |
| Grant date | Jul 24, 2007 |
| Priority date | — |
| Expiry date | Dec 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The carrier (30) comprises a first etch mask (14), a first metal layer (11), an intermediate layer (12), a second metal layer (13) and a second etch mask (17). Both the first and the second etch mask (14, 17) can be provided in one step by means of electrochemical plating. After the first metal layer (11) and the intermediate layer (12) have been patterned through the first etch mask (14), an electric element (20) can be suitably attached to the carrier (30) using conductive means. In this patterning operation, the intermediate layer (12) is etched further so as to create underetching below the first metal layer (11). After the provision of an encapsulation (40), the second metal layer (13) is patterned through the second etch mask (17). In this manner, a solderable device (10) is obtained without a photolithographic step during the assembly process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.