Wirebond crack sensor for low-k die
US7250311B2 · kind B2 · utility
20Cited by
13References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2005 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Aug 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor for measuring cracks in a semiconductor device, such as a wafer and, more particularly, to a BEOL wirebond crack sensor for low-k dies or wafers, and a method of providing the wirebond crack sensor for low-k wafers or the like structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.