Thermal managed interconnect system for a circuit board
US7251138B2 · kind B2 · utility
8Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2004 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | May 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal management system for an IC device mounted on a circuit board is provided. The system includes a socket housing and an array of power contacts disposed within the housing. The power contacts deliver power to an underside of the IC device and generate heat at the underside of the IC device. A heat conducting interface conveys heat from the underside of the IC device to a heat sink positioned above the IC device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.