Chong Wang
9Patents
2h-index
24Co-inventors
51Inventor score
Filing activity: Aug 11, 2000 → Oct 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6293331A | Vibration and shock resistant heat sink assembly | Electricity | 35 | Expired |
| US7251138B2 | Thermal managed interconnect system for a circuit board | Electricity | 8 | Expired |
| US10236273B2 | Packaging structure including interconnecs and packaging method thereof | Electricity | 1 | Active |
| US11655379B2 | Composite conductive polymers, preparation method and application thereof | Chemistry; Metallurgy | 0 | Active |
| US10784296B2 | Image sensor and manufacturing method therefor | Electricity | 0 | Active |
| US10424610B2 | Capacitor, image sensor circuit and fabrication methods thereof | Electricity | 0 | Active |
| US11599694B2 | Method for assessing fatigue damage and a fatigue life based on a crystal plastic welding process model | Physics | 0 | Active |
| US10629646B2 | Image sensor including doped regions and manufacturing method therefor | Electricity | 0 | Active |
| US11987937B1 | Airflow-enhanced embankment ventilation structure, composite embankment structure, and construction method thereof | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.