Embedded on-die laser source and optical interconnect
US7251389B2 · kind B2 · utility
38Cited by
3References
21Claims
0Family size
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Key dates
| Filing date | Sep 26, 2005 |
| Grant date | Jul 31, 2007 |
| Priority date | — |
| Expiry date | Sep 26, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/2852
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An apparatus and method for embedding a laser source on a semiconductor substrate and an optical interconnect to couple the laser source to internal components of the semiconductor substrate. An on-die waveguide is integrated on the semiconductor substrate. A package waveguide is disposed on the semiconductor substrate and evanescently coupled to the on-die waveguide. The laser source is embedded within the packaged waveguide to provide an optical signal to the on-die waveguide via the package waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.