Method and structure for identifying lead-free solder
US7251880B2 · kind B2 · utility
6Cited by
3References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2001 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Nov 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for determining whether solder used during assembly of a printed circuit board is lead-free or not. This may include providing a pad on the printed circuit board and placing solder on the pad in a predetermined pattern. The solder may be heated so as to create reflow. The solder may later be examined to determine if the solder is lead-free.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.