Polymer matrices for polymer solder hybrid materials
US7252877B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2003 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Dec 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.