Die package for connection to a substrate
US7253365B2 · kind B2 · utility
9Cited by
11References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2004 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Jun 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.