Quantum Leap Packaging, Inc.
4Patents
0Active
4Granted
27Portfolio score
Filing activity: Jan 13, 2004 → Aug 18, 2004
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6867367B2 | Package for integrated circuit die | Emerging Cross-Sectional Technologies | 38 | Expired |
| US7053299B2 | Flange for integrated circuit package | Emerging Cross-Sectional Technologies | 17 | Expired |
| US7253365B2 | Die package for connection to a substrate | Electricity | 9 | Expired |
| US6977432B2 | Prefabricated semiconductor chip carrier | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.