Techniques for providing EMI shielding within a circuit board component
US7254032B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2004 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | May 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board component includes a substrate having non-conductive material and conductive material supported by the non-conductive material. The conductive material defines a circuit board interface, a die interface, a heat spreader interface, and (iv) a set of connections which interconnects the circuit board interface, the die interface and the heat spreader interface. The component further includes a die coupled to the die interface. The die includes integrated circuitry which is configured to electrically communicate with a circuit board when the circuit board couples to the circuit board interface. The component further includes a heat spreader coupled to the heat spreader interface. The heat spreader is configured to dissipate heat from the die. The heat spreader in combination with the heat spreader interface forms an electromagnetic interference shield when a portion of the circuit board interface connects to a ground reference of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.