Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure
US7254883B2 · kind B2 · utility
3Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2005 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Aug 4, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The laminate is formed by placing a mask onto a packaging film and vapor-depositing aluminum onto the packaging film and the mask. After removal of the mask, only a desired antenna structure remains on a section of the packaging film. Then a microchip, is adhesively bonded to the packaging film and conductively connected to an end of the antenna structure, so that data can be written in or read out without contact in a wireless transponder system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.