Polishing system comprising a highly branched polymer
US7255810B2 · kind B2 · utility
1Cited by
21References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2004 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Dec 19, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a polishing system and method of its use comprising (a) a liquid carrier, (b) a polymer having a degree of branching of about 50% or greater, and (c) a polishing pad, an abrasive, or a combination thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.