Encapsulation for oled devices
US7255823B1 · kind B1 · utility
63Cited by
15References
48Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 6, 2000 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Aug 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/873
Abstract
An encapsulation for an organic light emitting diode (OLED) (201) device is disclosed. The encapsulation includes a sealing dam (280) surrounding the cell region of the OLED device to support a cap. The sealing dam provides a sealing region between the edge of the cap and dam in which an adhesive is applied to seal the OLED device. The use of the sealing dam advantageously enables devices to be formed with narrower sealing widths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.