Mold release layer transferring film and laminate film
US7255919B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2003 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Aug 12, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line.The releasing layer transfer film 1 for forming a releasing layer onto an insulating layer serving as a component layer of a COF flexible printed wiring board, the releasing layer transfer film includes a transfer film substrate 2 and a transferable releasing layer 3 provided on a surface of the transfer film substrate 2, wherein the transferable releasing layer 3 is formed from a releasing agent and can be transferred onto the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.