Air gap formation
US7256127B2 · kind B2 · utility
35Cited by
25References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2003 |
| Grant date | Aug 14, 2007 |
| Priority date | — |
| Expiry date | Mar 31, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24628
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.