Electrospray and enhanced electrospray deposition of thin films on semiconductor substrates
US7259109B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 22, 2004 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Jul 9, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D3/145
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a thin film on a substrate to fabricate a microelectronic device, a microelectronic device comprising a thin film deposited according to the method, and a system comprising the microelectronic device. The thin film may include on of a low k thin film, a thin film comprising photoresist, and a sacrificial polymer. The method comprises dispersing a precursor preparation into a spray of charged droplets through subjecting the liquid precursor preparation to electrostatic forces; directing the charged droplets to move toward the substrate; and allowing the charged droplets to generate a beam of gas-phase ions as the charged droplets move toward the substrate. The method further includes directing the gas-phase ions to impinge upon the substrate to deposit the thin film thereon to yield a deposited thin film on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.