Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
US7259354B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2004 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Aug 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
High speed removal of material from a specimen employs a beam positioner for directing a laser beam axis along various circular and spiral laser tool patterns. A preferred method of material removal entails causing relative movement between the axis of the beam and the specimen, directing the beam axis at an entry segment acceleration and along an entry trajectory to an entry position within the specimen at which laser beam pulse emissions are initiated, moving the beam axis at a circular perimeter acceleration within the specimen to remove material along a circular segment of the specimen, and setting the entry segment acceleration to less than twice the circular perimeter acceleration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.