Weisheng Lei
10Patents
6h-index
15Co-inventors
55Inventor score
Filing activity: Apr 14, 2004 → Oct 16, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8710402B2 | Method of and apparatus for laser drilling holes with improved taper | Electricity | 30 | Active |
| US7259354B2 | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories | Electricity | 22 | Expired |
| US7057133B2 | Methods of drilling through-holes in homogenous and non-homogenous substrates | Electricity | 14 | Expired |
| US7605343B2 | Micromachining with short-pulsed, solid-state UV laser | Electricity | 13 | Active |
| US8116341B2 | Multiple laser wavelength and pulse width process drilling | Electricity | 11 | Active |
| US9346130B2 | Method for laser processing glass with a chamfered edge | Performing Operations; Transporting | 8 | Active |
| US8415586B2 | Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses | Electricity | 2 | Active |
| US7985942B2 | Method of providing consistent quality of target material removal by lasers having different output performance characteristics | Electricity | 0 | Active |
| US7982161B2 | Method and apparatus for laser drilling holes with tailored laser pulses | Performing Operations; Transporting | 0 | Active |
| US9302350B2 | Method for laser processing glass with a chamfered edge | General | 0 | Revoked |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.