Semiconductor device with lead-free solder
US7259465B2 · kind B2 · utility
7Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2002 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Mar 24, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.