Patent · US Expired

Information containing means for memory modules and memory chips

US7260671B2 · kind B2 · utility

3Cited by

9References

9Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Eric Cordes · Isny im Allgäu, DE
Christian Stocken · Munich, DE
Nazif Taskin · Birkenfeld, DE
Norbert Wirth · Unterschleißheim, DE

Key dates

Filing date	Oct 23, 2002
Grant date	Aug 21, 2007
Priority date	—
Expiry date	Jun 14, 2023

Classification

Technology area (CPC G)Physics
CPC primaryG11C7/20
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A memory module includes at least one memory chip arranged on the memory module. Information about the memory module and/or the at least one memory chip arranged on the memory module can be stored directly on the memory chip, making use of a suited element, fuses or flip-flops, for example. A memory chip contains such an element for containing information relating to the memory chip and/or a memory module with which the memory chip is compatible, wherein the information containing element can be read out by means of an external processor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.