Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program
US7260806B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2005 |
| Grant date | Aug 21, 2007 |
| Priority date | — |
| Expiry date | Apr 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a printed wiring board design aiding apparatus, method, and program that can easily and inexpensively predict the displacement of a printed wiring board of complicated shape and configuration due to temperature change. The printed wiring board design aiding program makes a computer execute the steps including a mesh division step that divides an analytical model of a printed wiring board obtained as data into meshes, a mesh displacement calculation step that calculates displacements of respective meshes of a printed wiring board which is divided in the mesh division step, a mesh displacement connection step that connects mesh displacements calculated in the mesh displacement calculation step so that the inclination of borders of respective meshes become equal, and a displacement calculation step that calculates a displacement using an entire displacement of a printed wiring board which is obtained in the mesh displacement connection step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.