Apparatus and method for slicing an ingot
US7261099B2 · kind B2 · utility
3Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2005 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Oct 21, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9292
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for slicing an ingot may improve nanotopography at a surface of a wafer. In the method, an ingot is sliced into a plurality of wafers via a slurry while slurry is supplied to a moving wire. A first wire to form a first slicing portion at the wafer firstly slices one side of the ingot. A second wire secondly slices the remaining portion of the ingot to form a second slicing portion continued from the first slicing portion, wherein the first wire has a smaller diameter than that of the second wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.