Assembly with a ring and bonding pads formed of a same material on a substrate
US7262498B2 · kind B2 · utility
0Cited by
10References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 18, 2005 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Jan 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.