Procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate in a probe station

US7265536B2 · kind B2 · utility

Assignee

• SUSS MicroTec Test Systems GmbH · DE

Inventors

• Joerg Kiesewetter · Sacka, DE
• Axel Schmidt · Munich, DE
• Stefan Kreissig · Drebach, DE
• Karsten Stoll · Wilthen, DE
• Ralph Juettner · Dresden, DE
• Hans-Juergen Fleischer · Großenhain, DE

Key dates

• Filing date: Mar 1, 2006
• Grant date: Sep 4, 2007
• Expiry date: Mar 2, 2026

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2891
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.