Transparent microporous materials for CMP
US7267607B2 · kind B2 · utility
31Cited by
29References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 22, 2005 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Aug 18, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a chemical-mechanical polishing pad substrate comprising a microporous closed-cell foam characterized by a narrow pore size distribution in the range of about 0.01 microns to about 10 microns. The polishing pad is produced by foaming a solid polymer sheet with a supercritical gas under an elevated temperature and pressure until the sheet is saturated with gas. The invention is further directed to a polishing pad comprising the polishing pad substrate, a method of polishing comprising the use of the polishing pad substrate, and a chemical-mechanical apparatus comprising the polishing pad substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.