Method and apparatus for removing polymer residue from semiconductor wafer edge and back side
US7267726B2 · kind B2 · utility
5Cited by
13References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 22, 2003 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Aug 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for cleaning a semiconductor device has the steps of securing a wafer (16) with a modified chuck (11) and applying a cleaning solution (18) to the backside (20) of the wafer (16). The cleaning solution (18) is formulated to remove PTFE from the wafer (16). The cleaning solution (18) is applied to the edge (14) of the wafer (16) because of the characteristics of the modified chuck (11) to remove PTFE impurities that gather on the edge (14) of the wafer (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.