Fabrication method of light emitting diode package
US7268014B2 · kind B2 · utility
29Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2005 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Dec 22, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.