Inventor · Seoul, KR

Seog Moon Choi

57Patents
11h-index
54Co-inventors
77Inventor score

Filing activity: Dec 21, 2005 → Apr 16, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US7326964B2 Light emitting diode package with protective function against electrostatic discharge Electricity 69 Expired
US8017437B2 Method for manufacturing a semiconductor package Electricity 41 Active
US7268014B2 Fabrication method of light emitting diode package Electricity 29 Expired
US7547923B2 Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof Electricity 21 Active
US7262440B2 Light emitting diode package and fabrication method thereof Electricity 17 Expired
US7582496B2 LED package using Si substrate and fabricating method thereof Electricity 15 Active
US7649208B2 Light emitting diode package including monitoring photodiode Electricity 15 Active
US7453093B2 LED package and fabricating method thereof Electricity 14 Active
US7642656B2 Semiconductor package and method for manufacturing thereof Electricity 13 Active
US7566912B2 Light emitting diode package Electricity 13 Active
US7816156B2 Light emitting diode package and fabrication method thereof Electricity 12 Active
US7371603B2 Method of fabricating light emitting diode package Emerging Cross-Sectional Technologies 9 Active
US8198543B2 Rigid-flexible circuit board and method of manufacturing the same Emerging Cross-Sectional Technologies 8 Active
US8064215B2 Semiconductor chip package and printed circuit board Electricity 6 Active
US8493167B2 Transformer having the heat radiation function Electricity 5 Active
US7491978B2 Light emitting diode package Electricity 5 Active
US7875497B2 Method of manufacturing a semiconductor package Electricity 5 Active
US7696525B2 Surface mounting device-type light emitting diode Electricity 4 Active
US8012778B2 LED package and fabricating method thereof Electricity 4 Active
US7875983B2 Semiconductor package Electricity 4 Active
US8030762B2 Light emitting diode package having anodized insulation layer and fabrication method therefor Electricity 4 Active
US8842438B2 3D power module package Electricity 4 Active
US8736077B2 Semiconductor package substrate Electricity 3 Active
US8664755B2 Power module package and method for manufacturing the same Electricity 3 Active
US8553417B2 Heat-radiating substrate and method of manufacturing the same Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.