Patent · US Expired

Method for wafer stacking using copper structures of substantially uniform height

US7268015B2 · kind B2 · utility

0Cited by
3References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 21, 2006
Grant dateSep 11, 2007
Priority date—
Expiry dateMar 23, 2026

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/14
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for wafer stacking employing substantially uniform copper structures is described herein.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.