Substrate attaching method
US7268061B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2004 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Sep 26, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/28
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.