Semiconductor heating apparatus
US7268322B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2005 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Apr 5, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor heating apparatus, in which, when measuring the electrical properties of multiple chips formed on a large size wafer, only one or a several chips are heated uniformly, and the other chips are on standby at a low temperature. The semiconductor heating apparatus includes a heating part for mounting and heating the workpiece, a support part which supports the heating part, and a cooling module which contacts the support part. A plurality of heating parts and supporting parts are joined together. The workpiece mounting surfaces of the plurality of heating parts are preferably constructed in the same plane. In addition, there is preferably a thermal insulating material distributed underneath the support part. The heating part is preferably a ceramic heater.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.