Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond
US7268421B1 · kind B1 · utility
82Cited by
147References
100Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 22, 2006 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Jun 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.