Technique for manufacturing an overmolded electronic assembly
US7268429B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2005 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Dec 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, when joined. A backplate is also provided that includes a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate. A substrate includes a first side of an integrated circuit (IC) die mounted to a first side of the substrate. The backplate and the substrate are placed within the cavity of the second mold portion and the support pedestals are in contact with the first side of the substrate. The first and second mold portions are joined and the mold pins contact a second surface of the substrate during an overmolding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.