Apparatus for cleaning the edges of wafers
US7270136B2 · kind B2 · utility
5Cited by
36References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2001 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Jun 28, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention concerns an apparatus for cleaning the edge of a wafer that may be relatively simply constructed with low cost, and prevent the wafer from being re-contaminated by the edge cleaning, thus resulting in increase of the yield rate of wafers. The apparatus includes a cleaning agent ejection nozzle body provided on a side part of a chuck for ejecting a particulate cleaning agent (CO2 particles) towards the side and the edge portions of the wafer held and rotated by the chuck, and a nozzle body carriage for moving the nozzle body between rest and cleaning positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.