Micromechanical component

US7270868B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Thorsten Pannek · Stuttgart, DE
• Udo Bischof · Wannweil, DE
• Silvia Kronmueller · Schwaikheim, DE
• Jens Frey · Echterdingen, DE
• Ulf Wilhelm · Rutesheim, DE

Key dates

• Filing date: Jul 14, 2003
• Grant date: Sep 18, 2007
• Expiry date: Jul 14, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24628
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A component having a surface micromechanical structure containing both movable elements and immovable elements, and a method of manufacturing same are described. The surface micromechanical structure of the component is produced in a functional layer, which is connected to a substrate via at least one electrically non-conductive first insulation layer and at least one first sacrificial layer. The movable elements of the surface micromechanical structure are exposed by removing the first sacrificial layer. The first insulation layer is made of a material which is not substantially attacked by the process of removing the first sacrificial layer. Thus the removal of the sacrificial layer may be limited in a design-controlled manner. At the same time, a reliable electrical insulation of the surface micromechanical structure with respect to the substrate of the component and a reliable mechanical fastening of the immovable elements of the surface micromechanical structure to the substrate are ensured.