Jens Frey
29Patents
5h-index
54Co-inventors
68Inventor score
Filing activity: Sep 25, 2002 → Dec 17, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8490483B2 | Micromechanical yaw-rate sensor | Physics | 21 | Active |
| US7313958B2 | Rotational rate sensor | Physics | 20 | Expired |
| US7316161B2 | Rotation rate sensor | Physics | 14 | Expired |
| US9926188B2 | Sensor unit including a decoupling structure and manufacturing method therefor | Electricity | 7 | Active |
| US8748998B2 | Sensor module | Performing Operations; Transporting | 5 | Active |
| US7919346B2 | Micromechanical component and manufacturing method | Emerging Cross-Sectional Technologies | 3 | Active |
| US9567212B2 | Micromechanical component | Performing Operations; Transporting | 1 | Active |
| US7270868B2 | Micromechanical component | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9034757B2 | Method for manufacturing a component having an electrical through-connection | Electricity | 1 | Active |
| US9688527B2 | Micromechanical component and method for producing a micromechanical component | Performing Operations; Transporting | 1 | Active |
| US9919919B2 | Laser reseal including an additional layer and alloy formation | Performing Operations; Transporting | 1 | Active |
| US9266720B2 | Hybrid integrated component | Electricity | 0 | Active |
| US8975118B2 | Component having a via and method for manufacturing it | Electricity | 0 | Active |
| US8835222B2 | Method for producing a two-chip assembly and corresponding two-chip assembly | Electricity | 0 | Active |
| US9365417B2 | Method for manufacturing a micromechanical component | Performing Operations; Transporting | 0 | Active |
| US10000375B2 | Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface | Performing Operations; Transporting | 0 | Active |
| US9416000B2 | Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements | Performing Operations; Transporting | 0 | Active |
| US9406747B2 | Component in the form of a wafer level package and method for manufacturing same | Electricity | 0 | Active |
| US9123716B2 | Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates | Electricity | 0 | Active |
| US9114978B2 | Method for manufacturing a component having an electrical through-connection | Performing Operations; Transporting | 0 | Active |
| US8941193B2 | Method for manufacturing a hybrid integrated component | Performing Operations; Transporting | 0 | Active |
| US9606141B2 | Micromechanical sensor device | Emerging Cross-Sectional Technologies | 0 | Active |
| US11261082B2 | Micromechanical device and method for manufacturing a micromechanical device | Performing Operations; Transporting | 0 | Active |
| US9153523B2 | ASIC element including a via | Electricity | 0 | Active |
| US8759927B2 | Hybrid intergrated component | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.