Adhesion layer for Pt on SiO2

US7270884B2 · kind B2 · utility

Assignees

• Infineon Technologies AG · DE
• International Business Machines Corporation · US

Inventors

• Jingyu Lian · Plattekill, US
• Kwong Hon Wong · Wappingers Falls, US
• Michael Wise · Washington, US
• Young Limb · Poughkeepsie, US
• Nicolas Nagel · Yokohama, JP

Key dates

• Filing date: Apr 7, 2003
• Grant date: Sep 18, 2007
• Expiry date: Apr 7, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/12875

Abstract

Si, Al, Al plus TiN, and IrO2 are used as adhesion layers to prevent peeling of noble metal electrodes, such as Pt, from a silicon dioxide (SiO2) substrate in capacitor structures of memory devices.