Patent · US Expired

Substrate for producing a soldering connection

US7271484B2 · kind B2 · utility

85Cited by

7References

14Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Martin Reiss · Radeberg, DE
Carsten Bender · Dresden, DE
Kerstin Nocke · Dresden, DE

Key dates

Filing date	Sep 24, 2004
Grant date	Sep 18, 2007
Priority date	—
Expiry date	Jun 25, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/099
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that exposes a portion of the soldering pad. The opening has at least two edges that symmetrically overlie portions of the soldering pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.