Systems and methods for distributing I/O in a semiconductor device
US7271485B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2006 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Nov 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a number of package pins. In addition, the device includes a semiconductor die with at least two IO buffers. One of the IO buffers is located a distance from a particular package pin and another of the IO buffers is located a greater distance from the particular package pin. The IO buffer located closest to the package pin includes first bond pad electrically coupled to a circuit implementing a first interface type and a first floating bond pad, and the other IO buffer includes a second bond pad electrically coupled to a circuit implementing a second interface type and a second floating bond pad. In some cases, the first floating bond pad is electrically coupled to the circuit implementing the second interface type via a metal layer wire, and the first floating bond pad is electrically coupled to the particular package pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.