Donald E. Hawk
9Patents
4h-index
12Co-inventors
50Inventor score
Filing activity: Jul 21, 2000 → Aug 10, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6790760B1 | Method of manufacturing an integrated circuit package | Electricity | 11 | Expired |
| US6465882B1 | Integrated circuit package having partially exposed conductive layer | Electricity | 8 | Expired |
| US6476472B1 | Integrated circuit package with improved ESD protection for no-connect pins | Electricity | 8 | Expired |
| US8736076B2 | Multi-chip stacking of integrated circuit devices using partial device overlap | Electricity | 4 | Active |
| US7709861B2 | Systems and methods for supporting a subset of multiple interface types in a semiconductor device | Electricity | 1 | Active |
| US8370777B2 | Method of generating a leadframe IC package model, a leadframe modeler and an IC design system | Electricity | 1 | Active |
| US7429703B2 | Methods and apparatus for integrated circuit device power distribution via internal wire bonds | Electricity | 1 | Expired |
| US8627256B2 | Method for computing IO redistribution routing | Physics | 0 | Active |
| US7271485B1 | Systems and methods for distributing I/O in a semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.