Single package design for 3-axis magnetic sensor
US7271586B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2004 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Jun 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor package comprising an X-axis sensor circuit component, a Y-axis sensor circuit component, and a Z-axis sensor circuit component, each mounted to a top surface of a rigid substrate. To minimize the height of the package, a channel is cut out of the top surface of the substrate in order to accommodate the Z-axis sensor component. On the Z-axis sensor component, input/output (I/O) pads are all arranged in an array along one edge of the sensor to conductively cooperate with I/O pads, or solder-filled vias, on the substrate located at a top edge of the channel. Once the sensors have all been mounted to the substrate, the package is encapsulated, and the overall height is less than 1.2 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.